Circuit Card Assembly

Our automated and manual circuit card rework and repair capability supports all aspects of our manufacturing and depot requirements.

While our focus is on complex, high density RF Printed Circuit Boards, our surface mount capabilities also include:

  • Material and fault analysis equipment including cross-sectioning equipment
    • Supports the quick identification of root cause for complex internal component issues
  • Non-contact solder removal
  • Semi-automated component placement and removal
  • Split-vision optical alignment for QFNs and BGAs
  • Custom interface development for any type of SMT device
  • Automated conformal coat
  • X-ray inspection

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